System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...

Expertise from Forbes Councils members, operated under license. Opinions expressed are those of the author. So, what does this mean for the organizations that develop these products? It means that ...

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

With the proliferation of fiber-optic products containing interfaces ranging from Gigabit Ethernet to 10-Gbps SONET, the demand for optical testing capabilities is high. Unfortunately, so is the cost ...