Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.
Edge devices across multiple applications share common attack vectors. Security functionality must be designed in from the ...
Tariffs, EV costs and challenges, and fundamental architectural and technology improvements add up to transformative ...
New regulations make this non-negotiable, but multi-die assemblies and more interactions at the edge are creating some huge ...
A new technical paper titled “Enabling Physical AI at the Edge: Hardware-Accelerated Recovery of System Dynamics” was ...
A new technical paper titled “A Cryogenic Ultra-Thin Body SiGeSn Transistor” was published by researchers at TU Wien, ...
A new technical paper titled “Solving sparse finite element problems on neuromorphic hardware” was published by researchers ...
High-level synthesis (HLS) is a design flow in which design intent is described at a higher level of abstraction than RTL, such as in SystemC/C++ or MATLAB. HLS tools are expected to synthesize this ...
A new technical paper titled “Thermo-mechanical co-design of 2.5D flip-chip packages with silicon and glass interposers via ...
How to mitigate common errors that expose devices to security threats.
A new technical paper titled “A Survey on Acoustic Side-Channel Attacks: An Artificial Intelligence Perspective” was ...
A new technical paper titled “Gradient Electronic Landscapes in van der Waals Heterostructures” was published by researchers ...
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